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The TR7600TL SIII is the new Inline line scan 3D AXI, with CT capabilities specialized, designed for the inspection of larger board sizes, up to 1200mm x 660mm. The TR7600TL SIII Series platform delivers exceptional speed and performance without compromising imaging resolution.

優(yōu)點(diǎn)：
? Ultra-High Speed 3D CT X-Ray Inspection
? Ultimate Resolution AXI for Large Boards
? Smart Programming with Robust Algorithms

Imaging System圖像系統(tǒng)
Camera相機(jī)	Ultra-High Speed Line-Scan CCD Cameras (3 or 5 組)
X-ray Source X光管	Microfocus tube 130 kV max (可選)
Imaging Resolution圖像分辨率	10 μm, 15 μm, 20 μm, 25 μm (可選)
Inspection Method檢測(cè)方式	2D, 2.5D, 3D Slicing, Planar CT (可選)
Motion Table & Control運(yùn)動(dòng)控制臺(tái)
X-Axis Control X軸控制	High-precision ballscrew + AC-servo controller高精度滾珠絲桿和AC伺服驅(qū)動(dòng)
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution X/Y軸分辨率	1 µm
Board Handling
Max PCB Size PCB尺寸	Standard: 610 x 660 mm
Max PCB Size PCB尺寸	2 Stages: 1200 x 660 mm
PCB Thickness PCB厚度	0.6-7 mm
Max PCB Weight PCB重量	12 kg
Top Clearance 間隙	@ 25 μm: 50 mm
	@ 20 μm: 50 mm
	@ 15 μm: 30 mm
	@ 10 μm*: 15 mm
	* For confirming the specific technical requirements, please contact TRI’s sales representative
Bottom Clearance 底部間隙	@ 25 μm: 55 mm
	@ 20 μm: 70 mm
	@ 15 μm: 70 mm
	@ 10 μm: 70 mm
Edge Clearance 邊緣間隙	3 mm or 5 mm
Conveyor Height 軌道高度	880 - 920 mm
Conveyor Height 軌道高度	* SMEMA Compatible
Inspection Functions檢測(cè)功能
Component 元件	Missing 缺失
	Misalignment 偏移
	Tombstone 立碑
	Billboard
	Tantalum Polarity 反向
	Rotation旋轉(zhuǎn)
	Floating 浮高
Solder 錫膏	Insufficient/Excess Solder 少錫/多錫
	Bridging 橋連
	Open
	Solder Ball 錫球
	Non-wetting
	Void 無(wú)效
	Lifted Lead 翹腳
Dimensions尺寸
WxDxH 長(zhǎng)寬高	2014 x 2000 x 1940 mm
WxDxH 長(zhǎng)寬高	Note: not including signal tower, height: 510 mm
Weight 重量	4750 kg
Power Requirement 電源	200 – 240 VAC, Three Phase, 50 / 60 Hz, 7 kVA. Optional: 346 – 416 VAC Three Phase Transformer