英國(guó)牛津手持式面銅測(cè)厚儀CMI165產(chǎn)品特色： 

—— 可測(cè)試高溫的PCB銅箔 

—— 顯示單位可為mils，μm或oz 

—— 可用于銅箔的來料檢驗(yàn) 

—— 可用于蝕刻或整平后的銅厚定量測(cè)試 

—— 可用于電鍍銅后的面銅厚度測(cè)試 

—— 配有SRP—T1，帶有溫度補(bǔ)償功能的面銅測(cè)試頭 

—— 可用于蝕刻后線路上的面銅厚度測(cè)試

英國(guó)牛津手持式面銅測(cè)厚儀CMI165

The CMI165 provides unique temperature compensated Copper thickness measurements in an ergonomic hand-held device.
Measurements on Copper are affected by the temperature of the sample. The CMI 165 accounts for temperature in the measurement of thickness ensuring accurate in-process inspection results regardless of Copper temperature.  This versatile, portable gauge equipped with protective case, has a rugged and durable design that allows it to be taken into the harshest environments.

英國(guó)牛津手持式面銅測(cè)厚儀CMI165
深圳市鼎極天電子有限公司主營(yíng)產(chǎn)品：膜厚儀,鍍層測(cè)厚儀,膜厚測(cè)試儀,X射線測(cè)厚儀,鍍層厚度檢測(cè)儀,X熒光測(cè)厚儀